• Mon-Fri 8:10-17:10

COLLABORATION AGREEMENT (CA) WITH FILPAL (M) SDN. BHD.

Universiti Sains Malaysia (USM) through the Center of Excellence for Microelectronics Design Collaboration (CEDEC) today held a Signing Ceremony for the Memorandum of Understanding (MoU) as well as collaboration agreements and contributions with FILPAL (M) Sdn. Bhd. The ceremony saw the Deputy Vice-Chancellor for Research and Innovation, Professor Dr. Habibah A Wahab representing the Vice-Chancellor of USM, Professor Dato Seri Ir. Dr. Abdul Rahman Mohamed signing the MoU and MoA documents with two representatives from FILPAL (M) Sdn Bhd, namely the Chief Executive Officer of FILPAL (M) Sdn. Bhd., Dr. Wong Peng Wen, and the Operations Director of FILPAL (M) Sdn. Bhd., Ng Chong Lay."

  • Collaborative Microelectronic Design Excellence Center, Universiti Sains Malaysia
  • Sains@USM, Level 1, Block C, No. 10 Persiaran Bukit Jambul, 11900 Bayan Lepas, Pulau Pinang, Malaysia
  • Tel: +604-6535611 | Fax: +604-6535635 
  • Email: eeasrulnizam@usm.my

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