ISIS 2026 | Programme Schedule

International Semiconductor Innovation Symposium

ISIS 2026
Programme Schedule

A day of semiconductor innovation, advanced technology, industry insights and collaborative learning.

📅 Wednesday, 28 October 2026

📍 Setia SPICE Convention Centre, Penang

Explore the Programme

Sessions, keynote presentations, forum and technical talks — all in one place.

01

Morning Programme

Registration, opening ceremony and keynote presentations

8:15 – 8:50 am

● Lobby

Arrival

Registration

8:50 – 9:00 am

● Ballroom 3

Opening

Arrival of the Guest of Honour and VIPs

9:00 – 9:10 am

● Ballroom 3

Opening

Negaraku

Welcoming Remarks and Opening Prayer

9:10 – 9:20 am

● Ballroom 3

Welcome Address

Welcome Address by Campus Director, Tuanku Syed Sirajuddin Engineering Campus, USM

Professor Ir. Dr. Mariatti Jaafar@Mustapha

9:20 – 9:30 am

● Ballroom 3

Officiating Speech

Officiating Speech by Vice-Chancellor, Universiti Sains Malaysia

Professor Dato' Seri Ir. Dr. Abdul Rahman Mohamed, FASc.

9:30 – 9:40 am

● Ballroom 3

Launch

Launching of USM International Conference on Engineering 2026 (USM ICE 2026)

9:40 – 10:00 am

● Foyer

Refreshment Break

Tea Break

10:00 – 10:45 am

● Ballroom 3

Keynote 01

GaN Technology Demand: Rising with AI Server Chip Growth

Professor Dr. Edward Yi Chang

Associate Dean, Industry Academia Innovation School

National Yang Ming Chiao Tung University, Taiwan

11:00 – 11:45 am

● Ballroom 3

Keynote 02

Beyond the Silicon: Scaling AI Infrastructure and the Semiconductor Talent Pipeline

Mr. Daniel Yap Chew Seng

Global Education and Research Business Manager

Keysight Technologies

12:00 – 12:45 pm

● Ballroom 3

Forum 01

AI Semiconductor and Future Chip Design Ecosystem

Moderator: Mr. Ridza Effendi Abd Razak

Chief Executive Officer, Mixed Signal Technology (MST) Sdn. Bhd.

Panelists

Dr. Mitchell HsingChief Executive Officer, Co-founder · InchFab

Dr. Eng Rian FerdianHead of Technology Advancement and Education · Indonesia Chip Design Collaborative Center (ICDEC)

Mr. Yeap Soon LeeExecutive Vice President · Oppstar Technology Sdn. Bhd.

Mr. Amarjit Singh SandhuCorporate Vice President · Micron Technology

02

Afternoon Programme

Parallel sessions and technical presentations

1:00 – 2:00 pm

● Ballroom 4

Break

Lunch Break

2:00 – 3:20 pm

● Multiple Rooms

Concurrent Sessions

Parallel Sessions & Technical Talk

Function Room 3 · Parallel Session 1

AI-Assisted CMOS RF Power Amplifier Design and Optimization Using Cadence Virtuoso

Assoc. Prof. Dr. Jagadheswaran Rajendran

Senior Lecturer, CEDEC, USM

Function Room 4 · Parallel Session 2

Interposer Technology for Advanced Packaging Application

Mr. Naveen Prasad

Senior Engineer, CAD-IT Consultants (Malaysia) Sdn Bhd

Ballroom 3 · Technical Talk

Beyond Chip Design: Advanced Semiconductor Packaging, Failure Analysis and Future Innovations

Dr. Ng Chi Yung

Yield Development Engineer, Intel Corporation

3:20 – 3:40 pm

● Foyer

Refreshment Break

Tea Break

3:40 – 5:00 pm

● Function Rooms 3 & 4

Parallel Sessions

Parallel Sessions Continue

3:40 – 5:00 pm

● Ballroom 3

Technical Talk

From RTL to Silicon: How AI Is Changing the Way We Design

Mrs. Siew Ling Yeoh

Vice President of Engineering, Lattice Semiconductor