| 8:30 – 9:00 AM |
Registration
Participant registration and welcome reception.
|
| 9:00 – 9:30 AM |
Arrival of the Guest of Honour and VIPs
|
| 9:30 – 9:45 AM |
Speech by the Vice-Chancellor
Universiti Sains Malaysia.
|
| 9:45 – 10:00 AM |
Opening Speech & Launching of USM ICE 2026
|
| 10:00 – 10:15 AM |
Tea Break
Refreshments & Networking.
|
| 10:15 – 10:40 AM |
Keynote 1
Future AI Semiconductor and Advanced Manufacturing Technology.
Prof. Edward Yi Chang
Taiwan–Malaysia Overseas Science and Technology Innovation Center
|
| 10:50 – 11:35 AM |
Keynote 2
Future Advanced Packaging on Co Package Optic.
Keysight Technologies Sdn. Bhd.
|
| 11:45 AM – 12:30 PM |
Forum 1
AI Semiconductor and Future Chip Design Ecosystem.
Moderator:
Mr Ridza Effendi Abd Razak
Founder & Technical Director ValideSys Sdn. Bhd
CEO Mixed Signal Technology (MST) Sdn. Bhd
Panel Members
-
Dr. Mitchell Hsing
Chief Executive Officer & Co-founder
InchFab
-
Dr. Permata Nur Miftahur Rizki
Vice-Chairman
Indonesia Chip Design Collaborative Center (ICDEC)
- TBA
- TBA
|
| 12:30 – 2:00 PM |
Lunch Break
Networking Lunch.
|
| 2:00 – 3:30 PM |
Parallel Session 1
Advanced High Bandwidth Memory (HBM) Design (HBM) – AI Enhancement.
Assoc. Prof. Dr. Jagadheswaran Rajendran
CEDEC, Universiti Sains Malaysia
Parallel Session 2
Interposer Technology for Advanced Packaging Application.
Ansys
|
| 3:30 – 3:45 PM |
Tea Break
Coffee & Networking.
|
| 3:45 – 5:00 PM |
Parallel Sessions Continue
Technical sessions continue until programme closing.
|
