Welcome to CEDEC, Universiti Sains Malaysia
Attention Local Customers: Upcoming C18 MPW Tapeout
The next submission for C18 MPW tapeout is now open. Please submit your finalized designs to CEDEC by July 1, 2026. For technical specifications or further assistance, please contact out team at mpw@usm.my
The next submission for C18 MPW tapeout is now open. Please submit your finalized designs to CEDEC by July 1, 2026. For technical specifications or further assistance, please contact out team at mpw@usm.my
Postgraduate Studies Opportunities. Open All Year Long
PhD/MSc in Microelectronic System Engineering (Research)
Latest News
Grant: Digitalization of Teaching and Learning Method Using Binaural
16 June 2024, The workshops conducted at Batu Grace Children’s Home were made possible..
Read More 
COLLABORATION AGREEMENT (CA) WITH FILPAL (M) SDN. BHD.
18 March 2024, Universiti Sains Malaysia (USM) through the Center of Excellence for Microelectronics Design Collaboration (CEDEC)...
Read More News
17 March 2024
The German semiconductor company Nexperia mentioned USM
23 November 2022
COLLABORATION AGREEMENT (CA) WITH SKYECHIP SDN. BHD.
03 November 2022
STEM PROGRAM WITH SK. POKOK SENA, KEPALA BATAS
Core
IC Design & Sensor Research
MPW Services
EDA Tools
Testing & Measuremnet
Alumni
Alumni
0
Mixed-Mode
0
Research Mode
0
Industrial Student
0
