Test & Measurement
CEDEC has a suite of equipment for RF, digital and mixed-signal applications to cater various measurement needs. CEDEC can support on-wafer measurement (up to 8 inch wafer), on-chip measurement (die probing), on-board measurement and even outdoor measurement. With all of these equipment, CEDEC provides test and measurement services for research and development purposes.
![Image](/images/2021/06/14/test1.png)
To let us understand your test requirement, we would like you to provide the following information while contacting us:
- Type of test (On-Wafer, On-Packaged, On-Board or even outdoor test
- Type of application (RF, Digital or Mixed-signal)
- Name of the board or device
- Parameters or equipment needed
- For On-Wafer testing, layout of the device with pad assignment must be provided (The pad configuration must be designed according to CEDEC's Avilable probe)
- Other constraints need to be considered
For more information regarding the Test and Measurement at CEDEC, please do not hesitate to contact or consult with our staff:
Mrs Sofiyah Binti Sal Hamid
Collaborative Micro-electronic Design Excellence Centre (CEDEC)
Sains@USM, Level 1, Block C
No 10, Persiaran Bukit Jambul
11900 Bayan Lepas
Penang, MALAYSIA Phone: +604-653 5622
email: sofiyah@usm.my