Welcome to CEDEC, Universiti Sains Malaysia
Attention Local Customers: Upcoming C18 MPW Tapeout
The next submission for C18 MPW tapeout is now open. Please submit your finalized designs to CEDEC by July 1, 2026. For technical specifications or further assistance, please contact out team at mpw@usm.my
The next submission for C18 MPW tapeout is now open. Please submit your finalized designs to CEDEC by July 1, 2026. For technical specifications or further assistance, please contact out team at mpw@usm.my
Postgraduate Studies Opportunities. Open All Year Long
PhD/MSc in Microelectronic System Engineering (Research)
Latest News
USM Strengthens Regional Semiconductor Collaboration Through MoU Signing with ICDEC and GreatAsic
7 May 2026 - Universiti Sains Malaysia, Through its Collaborative Microelectronic Design Centre (CEDEC)...
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Technical Talk By Prof Fernanda Gusmao de Lima Kastensmidt
29 April 2026 – Collaborative Microelectronic Desing Excellence Centre (CEDEC) sucessfully..
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05 March 2026
CEDEC @ 10TH IEEE EDTM 2026
12 February 2026
CEDEC@National STEM Expo 2026
24 January 2026
CEDEC WELCOME MINISTRIAL INDUSTRY VISIT
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